Innovative Packaging | Leapers Unveils Next-Generation SiC Molded Modules: Compact, Lightweight, High-Power

Category: Company News Date: 2024-06-14 10:53 Author: Leapers

On June 11th, at the prestigious global power electronics event, PCIM Europe 2024, held in Nuremberg, Germany, Leapers proudly launched its next-generation molded half-bridge SiC modules for main drive applications (LPS-Pack series). This new series was specifically developed to meet the unique requirements of a renowned international automotive manufacturer.

Key Advantages of the New Product:

nInnovative Design Concept: Utilizing Pressfit Pin technology for signal and current transmission, the design achieves SiC on PCB, allowing current to pass directly through the PCB. This significantly reduces the parasitic inductance of the module and system, minimizes the controller's size, and lowers the cost of the controller's busbar and capacitors.


nAdvanced Molding Process: The new molding process allows the module's Tjmaxto reach 200.


nUnique Module Design: Ensures substrate flatness, facilitating large-area sintering between the module and the heatsink. This reduces the system's thermal resistance and enhances yield control processes.


nHigh Power Density: A single module (area < 26cm²) achieves a maximum current output of over 300Arms. The system design is extremely compact and cost-effective.


nVersatile Application: Suitable for platform-based and modular development applications. The series currently covers 300-600Arms, addressing various power requirements for different customer applications.


nMass Production Ready: Offers superior product consistency and yield, making it more competitive than similar half-bridge modules.


nThe LPS-Pack series' distinctive design and unique advantages set it apart from other molded solutions, attracting significant attention at the exhibition.


For more details on Leapers' participation at the exhibition, please stay tuned for our forthcoming official updates.