As a technology-driven enterprise, product innovation remains at the core of Leapers' competitive strength. At the 2026 Strategy Summit, Wilson Hong, CTO of Leapers, delivered a keynote speech unveiling a new generation of power modules targeting four key application markets: passenger vehicles, commercial vehicles, power supplies, and high-voltage applications. The launch demonstrated Leapers' deep understanding of industry demands and our ability to deliver differentiated solutions.
Six Years of Expertise: A Comprehensive Product Portfolio
At the outset of the launch, Wilson reflected on Leapers' product development journey over the past six years. He noted that through continuous dedication to power module technology, Leapers has built a mature product matrix covering a wide range of applications, establishing a strong reputation within the industry. Following nearly six months of market and platform consolidation, Leapers has further refined its product strategy to address distinct market segments.
Four Market Insights: Precision Solutions for Application Needs
Wilson emphasized that while power semiconductor module solutions continue to emerge, the key lies in addressing practical application pain points. Drawing on deep insights into different markets, Leapers introduced four targeted new products:
- Passenger Vehicle Market: LCD SiC Module
Featuring ultra-low stray inductance and ultra-low thermal resistance design, this module offers power scalability up to 300 kW and is compatible with SiC, IGBT, and RC IGBT layouts. It supports integrated current sensing and on-chip temperature detection, making it suitable for vehicle traction inverters, electric vessels, and motor drives.
- Commercial Vehicle Market: LDP SiC Module
Designed to meet the demands for high voltage, integration, and lightweight construction in commercial vehicles, this module features a symmetrical layout and epoxy encapsulation, providing resistance to shock and high temperatures. It supports a wide bus voltage range and is easy to use in parallel configurations. Ideal applications include commercial vehicle traction drives, construction machinery, electric aircraft, and high-power energy storage converters.
- Power Supply Market: LEP SiC Module
Targeting applications such as solid-state transformers (SSTs), this module combines low thermal resistance, high output power, and high power cycling lifetime. Its epoxy design offers excellent oil resistance, meeting the stringent reliability requirements of data center power supplies.
- High-Voltage Market: LPP SiC Module
Incorporating laminated busbar design and multi-chip parallel layout, this module features an insulation platform rated at over 6 kV and supports IGBT and SiC chips across voltage classes from 1200 V to 3300 V. It is well-suited for high-voltage, high-current applications including solid-state transformers, wind power converters, mining inverters, and traction converters.
The newly launched products not only build upon Leapers' accumulated expertise in low stray inductance, low thermal resistance, and high-reliability packaging, but also reflect Leapers’ keen insight into industry trends. Moving forward, Leapers will continue to be driven by technological innovation, delivering products and solutions of even greater value to its global customers.
