On March 29, 2026, Leapers officially broke ground on our new power module production base in Jiangdu District, Yangzhou. Representatives from Leapers' management team, shareholders, and project partners gathered to mark the milestone with a traditional groundbreaking ceremony.
Ceremony Highlights
Leapers CEO Xuanming Ding, Delian Capital Partner Dr. Fang, and Beijing Institute of Technology Huachuang Chief Engineer Dr. Zhuang delivered speeches celebrating the occasion.
Following the speeches, Leapers CTO Hong Wencheng invited guests to the foundation area for the ceremonial shoveling of soil — symbolizing the official start of construction and a new chapter for Leapers.
Project Scope & Capacity
Phase I of the automotive-grade third-generation power semiconductor module project represents a total investment of RMB 180 million. It spans 32 acres with approximately 31,000 square meters of floor space, including:
- Office building
- R&D and testing center
- Reliability lab
- Assembly and test facility
The phase will establish two automotive-grade SiC module assembly and test lines, with an annual capacity of 1.5 million units. The site will be equipped with over 100 advanced domestic and imported systems — including fully automatic silver sintering machines, vacuum soldering systems, automatic terminal and placement machines, printers, coaters, and terminal welders. The production lines will be automated, digitalized, and data-driven, with full integration of an MES traceability system for complete product lifecycle management.
