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HPD module

HPD series SiC MOSFET power module, circuit structure is Full Bridge. It integrates a high-performance SiC MOSFET chip and has a built-in temperature sensor. Especially suitable for electric vehicles, motor drives and other applications——Package size:W126.5*L154.5*H32 mm

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Part Number Type Package Circuit Diagram Blocking Voltage(V) Current(A) RDs(on)(mΩ) Tjmax(℃)
DFS01FB08HDB2S SiC HPD SiC 3-Phase 750 800 1.5 175
DFS01FB12HDB2S SiC HPD SiC 3-Phase 1200 900 1.5 175
DFS02FB12HDB2S SiC HPD SiC 3-Phase 1200 600 2.0 175
DFS03FB12HDB2S SiC HPD SiC 3-Phase 1200 400 3.0 175
DFS02FB12HDA1S SiC HPD SiC 3-Phase 1200 600 2.5 175
DFS02FB14HDA1S SiC HPD SiC 3-Phase 1400 800 2.3 175
DFS03FB14HDA1S SiC HPD SiC 3-Phase 1400 600 3.0 175