HPD series SiC MOSFET power module, circuit structure is Full Bridge. It integrates a high-performance SiC MOSFET chip and has a built-in temperature sensor. Especially suitable for electric vehicles, motor drives and other applications——Package size:W126.5*L154.5*H32 mm
Part Number | Type | Package | Circuit Diagram | Blocking Voltage(V) | Current(A) | RDs(on)(mΩ) | Tjmax(℃) |
---|---|---|---|---|---|---|---|
DFS01FB08HDB2S | SiC | HPD SiC | 3-Phase | 750 | 800 | 1.5 | 175 |
DFS01FB12HDB2S | SiC | HPD SiC | 3-Phase | 1200 | 900 | 1.5 | 175 |
DFS02FB12HDB2S | SiC | HPD SiC | 3-Phase | 1200 | 600 | 2.0 | 175 |
DFS03FB12HDB2S | SiC | HPD SiC | 3-Phase | 1200 | 400 | 3.0 | 175 |
DFS02FB12HDA1S | SiC | HPD SiC | 3-Phase | 1200 | 600 | 2.5 | 175 |
DFS02FB14HDA1S | SiC | HPD SiC | 3-Phase | 1400 | 800 | 2.3 | 175 |
DFS03FB14HDA1S | SiC | HPD SiC | 3-Phase | 1400 | 600 | 3.0 | 175 |