HPD module

HPD series SiC MOSFET power module, circuit structure is Full Bridge. It integrates a high-performance SiC MOSFET chip and has a built-in temperature sensor. Especially suitable for electric vehicles, motor drives and other applications——Package size:W126.5*L154.5*H32 mm

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Part Number Type Package Circuit Diagram Blocking Voltage(V) Current(A) RDs(on)(mΩ) Tjmax(℃)
DFS01FB08HDB1/L SiC HPD SiC 3-Phase 750 800 1.5 175
DFS02FB12HDB1/L SiC HPD SiC 3-Phase 1200 800 1.7 175
DFS03FB12HDB1/L SiC HPD SiC 3-Phase 1200 600 2.2 175
DFS04FB12HDB1/L SiC HPD SiC 3-Phase 1200 400 3.4 175